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Embedded Memory Solutions
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Embedded Solutions Simplify Integration of High-Capacity NAND in Embedded Applications
NAND Flash Due to its high reliability, low power requirements and cost/performance advantages, MLC NAND flash memory is the preferred data storage solution for portable electronic devices. Designers are increasingly turning to embedded NAND
solutions for high-capacity on-board storage as an alternative to lower density miniature hard disk drives.

To support the needs of current and emerging applications, Toshiba has developed several enabling embedded memory solutions using cutting-edge 43nm process technology. Each single-package solution includes high-density MLC NAND and a controller with a NAND, a high-speed MMC or SD interface. By combining high-density MLC NAND and the controller function in the same package, the need for host software drivers and memory management functions is minimized and the time to market is reduced, enabling designers to realize the cost/performance benefits of MLC NAND.    
Icon Arrow Embedded NAND Comparison Chart
Embedded MLC NAND and Controller Comparison Chart View
eMMC™ NAND
Ranging from 2GB to 32GB in capacity, Toshiba's eMMC embedded MLC solutions integrate a dedicated controller and are fully compliant with the MultiMediaCard Association (MMCA) Ver. 4.3 high speed memory standard for memory cards. The products support standard interfacing and an embedded controller manages functions such as error correction code (ECC), wear-leveling, and block management, simplifying integration into system designs.   more>>
eSD™ NAND
For consumer electronics designers who prefer an SD interface, Toshiba eSD™ NAND is a single-package solution combining a memory controller, error correction code (ECC), wear-leveling and block management with MLC NAND Flash memory. eSD™ NAND is available in 2GB - 32GB densities and uses an SD bus, allowing easy design of products using an open SD interface.     more>>
Multi-Chip Packages (MCP)
Toshiba multi-chip packages (MCP) offer multiple memory technologies such as, NAND Flash, NOR Flash, Pseudo SRAM (PSRAM), low power SDRAM, eMMC and eSD in a single package to simplify layout and save valuable board space in cellular phones and other space-constrained mobile electronics devices.    more>>
mobileLBA-NAND™
mobileLBA-NAND is a series of embedded NAND Flash memories, within MCPs, for mobile phones that offers both a configurable single-level cell (SLC) memory area and a multi-level cell (MLC) memory area, allowing applications and data to be stored on the same chip.    more>>
Package-on-Package
This enhanced MCP technology saves significant circuit board space in cellular handsets and other mobile devices by stacking a high-density memory component on top of the processor so the two components require only one footprint on the board. Toshiba is offering Low Power SDRAM and high-density NAND Flash PoP configurations in various PoP packages.     more>>
mobileLBA-NAND and GB-NAND are trademarks of TOSHIBA Corporation. eMMC is a trademark of the MultiMediaCard Association. All other trademarks and tradenames held within are the properties of their respective holders.