High reliability, low power requirements and cost/performance
advantages combine to make MLC NAND flash memory the preferred data storage
solution for portable electronic devices. Designers are increasingly
turning to embedded NAND solutions for high-capacity, on-board storage.
To support the ever-changing needs of current and emerging applications,
Toshiba has developed several embedded memory solutions which allow the
designer to choose the most appropriate NAND solution for their application.
e-MMC™ NAND
Ranging from 2GB1 to 128GB in capacity, Toshiba's
e-MMC embedded MLC solutions integrate a dedicated controller and are fully
compliant with the MultiMedia Card Association (MMCA) Ver. 4.41 high speed
memory standard for memory cards. The products support standard interfacing
and an embedded controller manages functions such as error correction code
(ECC), wear-leveling, and block management, simplifying integration into
system designs. more>>
SmartNAND™
Toshiba's SmartNAND series integrates leading-edge 24nm
process NAND flash technology with a control chip that supports robust
error correction code (ECC). SmartNAND is available in densities ranging
from 4GB to 64GB and simplifies design and time to market of advanced
NAND in consumer applications, including portable media players, tablet
PCs, digital TVs, set-top-boxes, and other devices that require high-density,
non-volatile memory. more>>
SLC NAND Flash
With fast read and write times and support for a large
number of write and erase cycles, Toshiba's SLC NAND supports applications
that require high performance and reliability, such as mobile phones,
office automation equipment, industrial storage, and servers. Advanced
32nm and 43nm SLC NAND products are offered with densities ranging from
512Mbits1 to 128Gbits. more>>
Toggle-Mode NAND
Toggle-Mode NAND is a DDR NAND solution designed to consume
less power than synchronous DDR NAND flash by eliminating the clock signal
typically used in synchronous DDR memories. Toshiba offers a lineup of
32nm DDR Toggle-Mode NAND, in MLC versions with densities of 64Gb1,
128Gb and 256Gb and SLC versions with densities up to 128Gb. more>>
Multi-Chip Packages (MCP/PoP)
By offering multiple memory technologies including NAND
Flash, low power SDRAM and e-MMC in a single package, Toshiba's multi-chip
packages (MCP) help simplify layout and save valuable board space in
cellular phones and other space-constrained mobile electronics devices.
Toshiba's Package-on-Package (PoP) technology saves significant circuit
board space in cellular handsets and other mobile devices by stacking
a high-density memory component on top of the processor. This allows
for two components to require only one footprint on the board. more>>
