toshiba worldwide   toshiba america
     
 
Search:  
 
Products
ASIC & Foundry
ASIC 65nm TC320
Foundry/COT
ASIC 90nm TC300
ASIC 0.11μm-TC280
ASIC 0.14μm-TC260
ASIC 0.25μm-TC240
Intellectual Property (IP)
EDA Tools
IBIS Models
Packaging
Applications
 Quick Links
  Link 1 RoHS/Lead(Pb)-Free
  Link 1   Stock Check
  Link 1   Sales Contacts
  Link 1   Complete Product List
 
 
Need Product Support?
Contact Us
 
Banner that links to Survey
Intellectual Property (IP)
Related Information
Press Releases  |  Product Briefs  | 
Toshiba supports a vast library of ready-to-use, pre- and post-tested IP for applications ranging from printers and storage to multimedia and networking. Our library includes ARM and MIPS processor cores, embedded memory, mixed-signal functions, high-speed SERDES for on-chip buses, chip-to-chip and chip-to-backplane interconnect, MPEG-4 and more.

To support additional IP requirements, Toshiba has partnered with a number of companies chosen because they provide proven, best-in-class IP and share its commitment to reduce time to market, design risk and cost for our customers. Toshiba is continually expanding its library with new cores for emerging application requirements.

Toshiba's basic CMOS processes used for custom System-on-Chip designs are developed with optional embedded DRAM and mixed-signal capabilities from the start to enable the creation of full system-level chips
Highlights
  • Industry Cost-effective, embedded DRAM cores for low-power and high bandwidth up to 32 Mb/instance, 256-bits wide; uses trench cell technology for manufacturability
  • High-speed serial interfaces up to 6.25 Gbps combined with digital IP cores and software to handle most industry-standard protocols
  • Mixed-signal cores include ADCs for converting data from sensors, DACs for driving image displays or audio, VGAs for analog signal compensation and PLLs
  • Pre-proven digital IP blocks for improved time to market, resource constraints and risk management
 
ARM Cores
The Toshiba Custom System-on-Chip solution incorporates a wide selection of cores including broad support for the ARM series of microprocessor cores and its associated peripherals. The ARM cores have been used in over 4 generations of technology and are fully supported by U.S.-based Toshiba Design Centers.
Supported ARM Cores:
  • ARM102EJ-S
  • ARM926EJ-S
  • ARM946ES
  • ARM7TDM1
In addition Toshiba supports the full set of ARM PRIMECELL™ peripherals and system components.
Embedded ARM RISC Core Roadmap
Click to view		   ASIC Click to enlarge
MIPS Cores
Toshiba offers a complete family of MIPS-based reduced instruction set computer (RISC) microprocessors and peripheral circuits. The Toshiba TX System RISC family consists of 32- and 64-bit processors ranging from low-power consuming to high-performance designs.
Toshiba TX System RISC Microprocessors Feature:
  • Products ranging from 200 to 666 MHZ
  • Special functions essential for the design of embedded products, such as reduced code size and real-time capability
  • State-of the art process technology with cores implemented in 130 and 90 nm processes
  • 64-bit superscalar architecture with leading price per MHz
TX System RISC Core Roadmap
Click to view		   ASIC Click to enlarge
Embedded Memory
Toshiba is the leader in embedded DRAM technology and is currently shipping its fifth generation of product in high-volume production.
Toshiba EDRAM Features And Benefits:
  • High performance with fast data transfer rates due to wide on-chip memory buses
  • Much denser than SRAM
  • Low power
  • Low Soft Error Rates (SER)
  • Multiple cores per chip
  • System architecture optimization and reduction of discrete components
  • Easy and effective testing with a direct-access test and DRAM BIST
  • High yield through redundancy in DRAM macros
  • Various types of DRAM macros with configurable depth and width
  • Trench process - one transistor DRAM cell structure utilizes trench process. The trench capacitor allows for a planar surface topology that enhances reliability without compromising logic performance
  • High bandwidth - freed from I/O restrictions, embedded DRAM cores provide high-memory bandwidth with asynchronous interface and a bus width selectable from 64-, 128- and 256 bits.
  • Configurable Macros - DRAM macros are configurable in depth and width to suit particular application requirements
Mixed Signal Cores
Toshiba offers a large portfolio of mixed-signal cores that can be customized for specific applications, and the engineering expertise needed to ensure successful implementation
Mixed Signal Capabalities Diagram
Click to view		   ASIC Click to enlarge
High Speed Serdes
Toshiba solutions range from 0.622 to 6.25Gb/s with support for PCI Express, USB 2.0, XAUI, Fiber Channel, SONET/SDH, SATA, Infiniband and others. Success requires proven I/O architectures plus an intimate link to silicon manufacturing.

Toshiba recently added the RAMBUS 6.25 Gb/s serial link cell technology to its library. This solution, coupled with the Toshiba advanced System-on-Chip technology, will enable next-generation SAN systems and backplane interconnects to achieve unprecedented bandwidth and network performance as well as density and die size at the lowest power. Toshiba is implementing this cell in its TC300 (90 nm) process technology