Toshiba aggressively brings leading-edge CMOS processes for advanced ICs in 300mm manufacturing for its customers. By leading the industry in producing high-performance system-level ICs in 90nm since 2003, plus early production of 65nm-with co-development of 40 nm and 32nm process technologies underway-Toshiba is able to stay ahead of the yield curve. We're continually solving DFM complexities to enhance performance, streamline time-to-revenue and reduce IC cost.

To stay ahead of the industry roadmaps and better serve cost-sensitive applications, Toshiba:

• Continues to invest heavily and ranks in the top worldwide semiconductor capital spending, with consistent capital investments of about $14+ billion planned 2008-2010. (Strategies for Growth, May 2008)
• Has achieved many firsts and ranks 5th overall in patents awarded (U.S. Patent Office - 2007).
• Maintains its leadership position and ranks 3rd in worldwide semiconductor revenue (Gartner, 2007 Ranking, Jan. 2008), only after Intel and Samsung, following a recent acquisition of the Sony semiconductor business.

• Ample capacity with multiple 300mm Fab state-of-the-art facilities in Oita and Nagasaki. The Nagasaki Fab was acquired in early 2008 from Sony.
• Reduced tooling cost through a select IP offering, allowing turnkey test and logistics
• Access to key IP, such as MIPS, ARM, SERDES-based IPs and a lot more
• Defect density at least one year ahead of industry; ideal for processor or FPGA
• Unparalleled Resolution Enhancement Technique (RET) for greater first time yield
• Ability to integrate low-power embedded DRAM
• World-class yield management and DFM methodology
• Fully characterized spice models and extraction data across all corners: drc/lrc/erc
• Complete product testing and logistics management
• Flexible business model with seamless interface of 3rd party assembly, substrate or test
• Reduced risk for our COT customers who have access to Toshiba's own IP library, reliable infrastructure, mask making and die package solutions.

Toshiba offers R&D, Design Analysis, guidance on DFM Analysis, Process and Modeling, Package and Substrate Design Services, Mask Making and Wafer Fabrication, Yield Management and Wafer Test, Die Test, Bumping and Assembly House interface.

Toshiba serves a wide range of customer applications including the digital consumer multimedia market, automotive, computing, wireless, and mobile/ networking segments of the communications market. We ensure performance, efficiency and cost advantage for mid- to high-volume customers like Sony who require hyper-competitive technologies that are ideal for high-density, high-speed system solutions as well as low-power applications. Toshiba also manufactures high-performance field programmable gate array (FPGA) products for Xilinx, the world's leading supplier of programmable logic solutions.

Ask us to conduct an optimization study to audit your company's current foundry engagement. See why global leaders choose Toshiba for a complete business solution. Our ability to work with technologies 1 to 2 years ahead of the industry, allows you to see around corners.