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1958     Toshiba produces the industry's first Square 17-inch Color Picture Tube.

1965   Toshiba America, Inc. establishes Electronics Components business sector to market Toshiba components in North America Himeji Works Production of 19" Color Picture Tube.

1969   Fukaya Works opens for CRT's for TV and Monitors

1972   Toshiba begins production of the first Blackstripe Slit Mask Color Picture Tube

1973   Toshiba begins research and development on SAW devices

1977   Toshiba produces first SAW Filter for TV-IF, at the Himeji Factory in Japan

1978   Toshiba begins production of the first Mini-Neck Color Picture Tube

1980   Toshiba produces world's first SAW Resonator for VCR RF modulator

1982   First Full Square color picture production For TV

1984   Introduction of INVAR Shadow Mask and first 15" Full Square Color Display Tube Production.

1985   Toshiba develops 1-megabit CMOS dynamic RAM. Toshiba introduces world's first SAW Resonator Filter for pagers

1986   Toshiba Display Devices (TDD), in Horseheads, NY began production of 19/20" Color Picture Tubes. Toshiba introduces world's first wide-band SAW Filter for TV-IF

1987   Toshiba produces world's first SAW Filter for cordless phone Toshiba produces world's first UHF SAW filter for satellite receiver

1988   Toshiba America, Inc.'s Electronic Components business sector (TAEC) relocates to Irvine, CA. Toshiba begins using Impregnated Cathode in its Color Picture Tubes Toshiba announces improved high-speed CMOS Logic family of devices Toshiba develops 4 megabit DRAM Toshiba introduces new monochrome high-contrast LCD

1989   Display Technology, Inc., (DTI) a joint venture between Toshiba Corporation and IBM Japan, LTD, established to manufacture thin film transistor LCD's Toshiba completes clean room at Sunnyvale facility for custom development and metallization of Gate Arrays Toshiba invents NAND Flash technology Toshiba develops resist asher by ultraviolet ozone for large LCDs Toshiba markets Visible-Light Emitting Laser Diodes (VLDs) with the world's shortest wavelength of 660 nanometers

1990   Toshiba and Siemens announce cooperation in RISC microprocessors with MIPS architecture Toshiba enters RISC Chip business with License for MIPS' R3000/R4000 Series Toshiba Display Devices (TDD) in Horseheads, New York, becomes wholly owned subsidiary of TAEC Toshiba becomes one of the first Rambus licensees Toshiba develops prototype VLD with the world's shortest wavelength of 638 nanometers. Toshiba develops new LCD for notebook computers Toshiba's Gate Turn-Off Thyristor's receives R&D 100 Award Toshiba announces its support for Echelon's LON Neuron™ Chip

1991   Toshiba develops the world's first 4-megabit NAND-type EEPROM Toshiba introduces the world's fastest Bi-CMOS Logic ICs Toshiba announces its first Neuron Chip, which is the foundation of Echelon's LONWORKS™ Technology Toshiba develops red-light semiconductor laser with the world's highest optical output power Toshiba's CCD imaging technologies wins 1991 EMMY Awards Toshiba begins operations at Display Technology, Inc. Toshiba introduces the world's shortest wavelength VLD at 650 nanometers

1992   Toshiba introduces its VHC family featuring high speed, low power and low noise. National Semiconductor joins Toshiba as second source for this product Toshiba markets its R4000 64-bit microprocessor based on MIPS architecture

1993   Toshiba and Synopsys announce cooperation in high-level design automation for next-generation ASICs Toshiba introduces its 16-bit microcontroller family Toshiba receives ISO 9000 certification Toshiba joins with National Semiconductor and Motorola Semiconductor Products Sector to form the Low-Voltage Logic Alliance to develop standards and common specifications for logic and jointly introduce and promote high-performance, low-voltage CMOS logic products Toshiba first to offer 1700V IGBTs Toshiba offers its R4600 32-bit microprocessor to the market

1994   Toshiba completes ISO 9001 requirements Vertex Semiconductor merges into Toshiba America Electronic Components and becomes part of the System IC group Toshiba granted Pre-Importation Review Program (PIRP) status by U.S. Customs in recognition of superior trade compliance performance Display Technology, Inc. announces increased capacity for the manufacturing of TFT LCDs

1995   Toshiba develops innovative capacitor structure for 1-Gigabit DRAM memory cell. The highly compact bottle-shaped trench capacity enables development of smaller, more efficient DRAM cells Toshiba and Winbond enter partnership to produce and develop semiconductor memory devices Toshiba develops unique data storage medium for small form factor applications: Solid State Floppy Disk Card Motorola to join alliance of IBM, Siemens and Toshiba to develop advanced memory devices Toshiba announces partnership with Digital Equipment Corporation to jointly develop highly optimized 155 ATM SAR LSI's Toshiba and IBM form Dominion LLC joint venture to produce DRAM in Manassas, VA IBM, Siemens and Toshiba alliance announces smallest fully functional 256Mb DRAM Toshiba strikes alliance with Samsung for joint development of 64Mb NAND Flash memories The Low-Voltage Logic Alliance introduces LCX as its first, high-performance, low-voltage product, with over-voltage tolerance. This standard is also supported by SGS-Thompson and Pericom Toshiba introduces microfilter™ for Color Display Tubes. Toshiba introduces its multimode Communications Laser Diodes (CLDs) Toshiba unveils its R3900 32-bit microprocessor core

1996   Toshiba develops world's first circuit technology for 0.5V operation of ICs Toshiba and Samsung Electronics to cooperate on Solid State Floppy Disk Card SmartMedia storage solution Toshiba enters the Surface Mount LED market Toshiba develops first self-pulsating Laser Diode for DVD applications Toshiba first with Press Pack IGBTs

1997   Toshiba introduces its MIPS RISC Development Platform for Window CE-based applications Toshiba announces architecture for new low-power TX19 microprocessor family Toshiba claims world leadership in Embedded DRAM with proprietary trench process The Low Voltage Logic Alliance (Toshiba, Fairchild and Motorola) announces the industry's first 2.5V CMOS logic standard with 3.6V-tolerant inputs and outputs Toshiba licenses MIPS16™ Architecture; announces roadmap for full line of MIPS RISC microprocessors from 32-bit through 64-bit

1998   Toshiba produces world's first 0.25-micron embedded DRAM ASIC for Pixelworks' Image Processor Toshiba and Fujitsu announce collaboration to develop next-generation 1-Gigabyte DRAM. Toshiba announces the industry's first 8.4- and 10.4-inch Low-Temperature Poly-Silicon LCD's Toshiba deploys global Scalable by Design™ program and manifests quick process migration for industry-leading manufacturing efficiency Production of Color Display Tubes begins at Toshiba Display Devices, Horseheads, NY Toshiba announces first microprocessor from TX49 Family; 64-bit processor boasts world's lowest 64-bit power consumption at 1.2 watts Fujitsu, NEC and Toshiba agree on specifications for stacked Multi-Chip Packages compatible with all high density Flash memory and SRAM for cell phones and other handheld devices Toshiba debuts new high-performance 8-Bit microcontroller series. Toshiba introduces first shadow mask flat face Color Picture Tube in Japan Toshiba begins qualified production of 64Mb DRAMs at Dominion Semiconductor, and Toshiba's 64Mb SDRAM secures Intel® PC100 validation TAEC adds Disk Products Division to its operations; product offerings now include Hard Disk, CD-ROM and DVD drives The Low Voltage Alliance introduces the 2.5V VCX family, the first industry standard product offering to provide mixed-voltage compatibility with both 3.6V and next-generation 1.8V components Toshiba's 0.25-micron System-Level ASIC family integrates more than 10 million usable gates Toshiba announces the industry's first reflective and low-temperature poly-Silicon (LTPS) TFT LCD technology

1999   Toshiba and SanDisk agree to jointly develop and jointly manufacture gigabit scale flash memories Toshiba develops world's first 15-inch Low-Temperature Poly-Silicon TFT LCD with UXGA resolution Toshiba introduces the smallest and thinnest five-pin CMOS Logic package Toshiba announces plan to buy out IBM's stake in Dominion Semiconductor joint manufacturing venture in Manassas, VA, by Dec. 2000, and use additional capacity for DRAM and NAND production Toshiba introduces world's smallest, thinnest 16-pin and 20-pin CMOS Logic packages Toshiba develops industry's first 512Mb NAND Flash components and 64MB SmartMedia cards by packaging two 256Mb NAND die in TSOP and SmartMedia packaging Toshiba introduces the industry's first internally matched 60-Watt C-Band GaAs FET Toshiba releases 0.14µm SLI ASIC Libraries with Embedded DRAM and application-specific cores Toshiba's new Low-Temperature Poly-Silicon LCD facility begins operation in Fukaya, Japan. Fukaya Works is Toshiba's first facility dedicated to the production of large-size, Low-Temperature Poly-Silicon TFT LCD's Toshiba launches industry's smallest 128Mb and 144Mb Rambus DRAM die Toshiba moves up from the world's fifth largest semiconductor supplier to fourth in Dataquest rankings Toshiba develops first prototype of a nonvolatile Chain Ferro-electro RAM (Chain FRAM). Breakthrough design combines high-speed read and write operations with a small chip size and surpasses the performance of existing FRAM Fujitsu and Toshiba announce joint development agreement for Fast Cycle RAM (FCRAM) in 64-, 128- and 256-Megabit densities to achieve operation cycles two to three times faster than conventional DRAMs Toshiba announces its 4-inch Low-Temperature Poly-Silicon TFT LCD technology Toshiba enables 350mips/W performance with new TMPR1940 microprocessor family Toshiba licenses ARM7TDMI RISC Core NEC Corporation and Toshiba Corporation expand their commitment to MIPS Technologies, Inc.

2000   Toshiba's New Fabrication Method of Gate Oxide for MOS Devices Will Improve Long-term Reliability of LSI EDN Magazine Names Toshiba's NAND Flash Memory One Of Its Hot 100 Products Of 2000 Toshiba Announces Availability Of World's First Low-Power, Single-Chip MPEG-4 Decoder. Toshiba Launches First Portable PC Host-Controller LSI For SD Memory Card And SmartMedia Toshiba And Tessera Announce Innovative Technology Licensing Agreement Amkor And Toshiba Form Joint Venture; First Major Assembly And Test Foundry In Japan Toshiba America Electronic Components, Inc. Introduces New Online Technical Support On Web Site Toshiba Introduces World's First 8.4-Inch SVGA Low-Temperature Poly-Silicon TFT LCD For High-Brightness Industrial Applications Toshiba Introduces World's First 5.8-Inch And 7.0-Inch High-Resolution, Wide-Format, Low-Temperature Poly-Silicon TFT LCDs Toshiba Introduces The Industry's First Embedded 64-Bit MIPS CPU SLI ASIC Core Toshiba To Build Advanced System IC Facility At Its Oita Plant Toshiba Demonstrates World's First 4-Inch, 202 Pixel Per Inch Color Reflective Low Temperature Poly-Silicon TFT LCD Toshiba Makes Major Investment In Facilities For Large-Sized Low-Temperature Poly-Silicon TFT LCDs Toshiba Develops Industry's First 64Mb Read While Write Nor Flash Memory Device Toshiba Details World's First Single-Chip MPEG-4 Videophone LSI With Embedded 16MBIT DRAM At ISSCC Microprocessor Report Names The Sony/Toshiba Emotion Engine Best Embedded Processor Of The Year.

2001   Toshiba's New Regulator IC Offers The World's Lowest Current Consumption For Automotive Applications Toshiba Debuts One-Gigabit NAND Flash Memory Device Toshiba and Matsushita to Establish a Joint Venture for Procurement of Parts and Materials for CRT Production Toshiba and Matsushita to Unify LCD Business Toshiba Introduces First NAND Flash Drives Optimized For Industrial Applications Toshiba Announces Industry's First 64Mb Pseudo SRAM Family TAEC Introduces EDRAM Core With 12-Ns Access Time For SRAM Replacement; New ASIC Capability Delivers Fastest Access Time In 0.18-µM CMOS Toshiba Has First Microcontroller With SD Memory Card Controller Toshiba Unveils Its Roadmap For Continued Leadership In The Flash Memory Market Simplex And Toshiba Change The Face Of Chip Design By Enabling Revolutionary IC Architecture Semiconductor Industry Leaders Launch Initiative To Support Radical New Chip Architecture Toshiba Develops World's First 260,000-Color Polymer Organic Light Emitting Display Toshiba Expands Industry-Leading Portfolio Of Microwave Components With New Modules For Telecommunications Infrastructure Equipment Toshiba And Avnet Form Global Distribution Network Toshiba Joins Forces With Arrow Electronics To Create Global Distribution Network Toshiba America Electronics Components Launches ArTile Microsystems To Provide Rapid System-On-A-Chip Designs Toshiba And Sony Computer Entertainment Inc. To Make A Technical Alliance For 0.13 Micron Rule Semiconductor Embedded DRAM Logic Process Sony Computer Entertainment Inc., IBM And Toshiba Join To Develop "Supercomputer-On-A-Chip" For The Broadband Era Toshiba Introduces Advanced Lithium Batteries For Sleeker, More Compact Designs In Wireless Communications Devices Toshiba Announces Development Of White LED Toshiba Announces The World's First Single-Channel Interface Driver ICs Toshiba Launches World's First 32-bit CISC Microcomputers with Memory Integration.

2002   Toshiba And Sony Make Major Advances In Semiconductor Process Technologies AFPD Pte. Ltd. Celebrates Official Plant Opening And Start Of Production Of Advanced TFT-LCDs In Singapore Toshiba Expands Silicon Germanium Transistor Line Up With Industry's Smallest Package Sandisk and Toshiba Announce Development of 90 Nanometer Process Technology for Binary and MLC NAND Flash Toshiba America Electronic Components, Inc. Becomes First Semiconductor Company to Receive New C-TPAT Customs Certification Toshiba Adds To High-Performance Memory Portfolio With 333MHz Network FCRAM™ Family For Networking And Server Applications New Voltage Regulator IC for Automotive Applications from Toshiba Achieves World's Lowest Power Consumption M-Systems and Toshiba Sign Collaboration Agreement Pertaining to Development, Marketing and Supply of New DiskOnChip Products New CISC 32-Bit Microprocessor from Toshiba Combines Integrated Color LCD, USB and NAND Flash Memory Controllers and Attains World's Lowest Power Consumption New RISC Companion Chip from Toshiba is First IC with On-Chip ATA/ATAPI, USB Device/Host, I2C and PCI Controllers Toshiba Announces the Industry's Highest Power Ku-Band GaAs FET for Satellite Communications Toshiba Reaffirms Commitment to LCD Market Through the Development of Advanced Display Solutions Toshiba Announces the Industry's Lowest Power Consumption Photocoupler Toshiba Announces the Industry's First 60 Watt Extended C-Band GaAs FET for Satellite Communications IBM, Sony, SCE and Toshiba to Jointly Develop Chip-Making Process Technology Toshiba Develops the World's Smallest Stacked Multi-Chip Package Currently Available Electronic Products Magazine Chooses Toshiba's White LED As One of the 2001 "Products of the Year" Agere Systems Selects Toshiba's FCRAM For Use With OC-192 PayloadPlus Network Processor Artile, Simplex and Toshiba present first application of the X Architecture as ISSCC Toshiba and Matsushita Announce Outline of New LCD Joint Venture Toshiba Named EDN 2001 Innovation of the Year Awards Finalist for its MPEG-4 Video CODEC Toshiba Enters U.S. Automotive Market With Cost-Effective Single Chip Solution For Car Information Systems.

2003   Toshiba Offers New Line Of 1200V IGBT Modules Using Injection Enhanced Gate Transistor Process Technology To Achieve Higher Performance Toshiba Introduces New PS-8 Lead-Free Ultra-Thin Package For MOSFETS And Low Saturation Bi-Polar Transistors Toshiba Introduces New Family of Power MOSFETs With Advanced Process Technology To Enable Faster Switching Speeds Toshiba Discloses SoCMosaic™ Custom Chip Hardware/Software Co-Development Strategy And Announces First Two Supported Environments, SwordFish And Seamless Toshiba Announces World's Smallest Direct Methanol Fuel Cell With Energy Output Of 1 Watt To Be Used For Portable Devices Toshiba Announces MOSFETs Using New SOP Advance Packaging And Ultra High Speed Process Technology For Improved Power Efficiency Toshiba Offers Lead-Free Versions Of All Its NAND Flash Memory Devices In TSOP Packages Toshiba Licenses High-Performance ARM Core For Custom SoC Business Toshiba America Electronic Components, Inc. Announces Plans To Implement Lead-Free Manufacturing Supporting Industry Environmental Initiative Toshiba Adds Wider, x16 NAND Flash Memory For Faster Read Cycles In Cell Phones And Mobile Electronics Applications Toshiba Offers Complete MCP Solutions For Cell Phones With NOR Flash, NAND Flash, SRAM, Pseudo SRAM Or Low Power SDRAM Toshiba Announces 2-Gigabit NAND Featuring Automatic Erase And Program Operations For File Storage Applications New Toshiba CMOS Image Sensor Camera Enables Wireless Transmission Of High-Quality Photos For Next-Generation Phones And PDAs Toshiba And SanDisk Announce Novel NAND Cell Architecture Enabling Major Advances In Flash Memory Capacity Toshiba Announces The Industry's First 90-Watt C-Band GaAs FET For Satellite Communications Toshiba Expands 60-Watt C-Band GaAs FET Product Line To Provide New SSPA Market Opportunities For Satellite Communications Toshiba Announces Highest Output Power Ku-Band GaAs FET For VSAT Satellite Communication Applications Toshiba Announces Industry's First Single Die MOSFET And Schottky Barrier Diode For DC/DC Converters Toshiba Launches Two New 64-Bit RISC Microprocessors, Its First Standard Processors Based On Leading-Edge 90nm Process Technology Toshiba Announces Mosfets Using New Ultra High Speed Process And Revolutionary Bonding Technology For Improved Power Efficiency Toshiba Extends High Luminosity White LED Offering With Addition Of Bluish Green And Purple LEDs Toshiba America Electronic Components Demonstrates First "System On Glass" (SOG) Input Display With Built-In Image Capture Toshiba Launches First SoCMosaic Custom Chip, An Arm-Based Controller For Low-End Networking And Consumer Convergence Applications Toshiba Rolls Out New Single-Chip High-Definition Digital Multimedia Decoder Chip Toshiba's White LED Selected As Recipient Of The 2002 Photonics Circle Of Excellence Award Toshiba Develops Five- And Six-Chip Multi-Chip Packages Combining NOR Flash, SRAM, Pseudo SRAM And NAND Flash For Advanced Cell Phone Applications Toshiba Adds Modified NAND Flash Memory For Easier Integration In Advanced Cell Phones With Complex Memory Subsystems Toshiba Adds High-Speed Transmitter/Receiver For Automotive Lan To Its TOSLINK™ Family Of Fiber Optic Devices M-Systems And Toshiba Unveil Mobile DiskOnChip G3 - The World's Smallest High-Capacity NAND-Based Memory Solution Toshiba Announces 32-Megabit FeRAM Developed With Infineon Toshiba Launches SoCMosaic Custom Chip Platform Toshiba Announces 128Mb Pseudo SRAM Family; Highest Density Available For Mobile System Applications Toshiba Tells Advanced Soc Strategy, Launches 90NM TC300 Family Targeted At High-Performance Applications.

2004   Toshiba Announces Expansion Of Power Mosfet Packaging Solution With Smaller, Thinner TSSOP Advance Package With Lead-Free Finish Toshiba Expands Family Of SOP Advance Mosfets With 8 New Lead-Free Finish Devices For Greater Power Efficiencey Toshiba Announces Industry's Smallest GaAs MESFET Switch For Multi-Band/Multi-Mode Cellular, Bluetooth and WLAN Applications Toshiba Announces World's Smallest Safety-Standard Compliant Photocoupler Toshiba, Xilinx Announce Strategic Foundry Relationship, Reach 90nm/300mm Manufacturing Milestone Toshiba Expands World's Smallest LMOS Logic IC Series With Low Voltage, Low Power Consumption Devices Toshiba Announces Availability Of White Paper On Lead(Pb)-Free Manufacturing And Products International Electrotechnical Commission Forms Working Group To Set Industrial Standard For Micro Fuel Cells Toshiba Unveils New Smart Thin Package For Power MOSFETs With Industry's Smallest Mount Area Per Milliohm Of On-Resistance Toshiba Announces World's Smallest Direct Methanol Fuel Cell With Energy Output Of 100 Milliwatts Toshiba To Start Production Of Industry's First SOC With The X Architecture Toshiba Debuts First Full-Color "System On Glass" (SOG) Input Display With Image Capture Technology Toshiba Introduces New 1.8v Multi-Chip Package Memory Solutions With Burst Mode Capabilities For Next-Generation Cellular Phone Applications Toshiba Tapes Out Multiple 90-Nanometer SoC Designs With Synopsys' Galaxy Design Platform Toshiba Starts the Construction of State-of-the Art Wafer Fab For NAND Flash Memory At Yokkaichi Operations Toshiba Unveils 512Mb Network FCRAM™, The Industry's Largest Density Low Latency DRAM For Network Applications Toshiba Takes NAND Flash Memory To 4-Gigabit Level Using 90 Nanometer Process Technology Toshiba Completes Construction of Building for 300mm Wafer Fab at Oita Operations in Kyushu Toshiba Matsushita Display Technology Announces World's Lowest Power 14.1-Inch Displays For Mobile PCs Agere Systems First Company To Offer Multiple Sources Of Low-Latency, DRAM Memory Chips For Network Processor Customers Toshiba Develops Multi-Chip Package (MCP) Which Realizes Stacking Of 9 Layers With 1.4MM Thickness.

2005   Toshiba Announces Line-Up Of Toshiba-Branded USB 2.0 Flash Drives Plus Customizable USB 2.0 Flash Drive Subassemblies For OEMs

2006   Hitachi, Toshiba and Renesas Agree to Establish Semiconductor Foundry Planning Company Toshiba Announces 16-Gigabit Multi-Level Cell Nand Flash Components Using 70-Nanometer Process Technology Toshiba Showcase 6GHz, 174W Gallium Nitride Power FET At MTT-S; Unveils Roadmap For GaN Microwave Devices Toshiba Expands Frequency Ranges Of 9W And 30W Extended Ku-Band GaAs FET Lines For VSAT Satellite Communications Toshiba America Electronic Components Announces Expanded Line-Up RoHS-Compatible Industrial LCD Displays, Including An Ultra High Luminance 12.1-Inch SVGA LCD For Outdoor Use Toshiba rolls out second-generation, single-chip solution for mid-range and low-end digital TV applications driven by the Congressional mandate that all U.S. broadcast televisions must be completely converted to digital terrestrial transmissions by 2009 Toshiba, Sony Corporation and NEC Electronics Corporation announce the successful co-development of an LSI mass production platform for next-generation 45 nm process technology

2007   Toshiba reveals strategic initiative for mobile handset market to speed time-to-market with flexible, modular analog peripheral and mixed-signal building blocks Toshiba announces MIPI Display Controller that supports the high-speed MIPI DSI standard Toshiba retains position as the number one ranked supplier of optoelectronics, sensor/actuators and discrete components (OSD) in 2007 (April 2007, IC Insights), for the 22nd year TAEC and TMD announced an expanded line-up of RoHS-Compatible4 industrial LCD displays, including an ultra high-luminance 12.1-inch SVGA LCD for outdoor use Toshiba introduces its first commercial GaN semiconductor, a 50W, X-band HEMT for radar and medical applications New Toshiba 50MBd High Speed Photocoupler Is The Fastest Yet In The Company's Lineup Toshiba Expands LED Product Line With Compact New Generation White LEDs That Are Twice As Bright Toshiba and SanDisk mark the opening ceremony for a second 300 mm wafer fab at Toshiba's Yokkaichi Operations, due online in Q407 to meet fast growing demand for NAND flash memory Toshiba Announces Gallium Nitride Power FET With World's Highest Output Power In Ku-band Toshiba introduces a family of MLC NAND based solid state disk drives

2008   Toshiba Adds High Efficiency, 35A DrMOS-Compatible Multi-Chip Module For DC-DC Converters In Servers Toshiba and SanDisk announce sampling of 16Gb 43nm MLC NAND New Industrial LCD Panels With Long-Life LED Backlighting Systems From Toshiba America Electronic Components, Inc. Toshiba Expands GaN HEMT Product Family With Power Amplifiers For Ku-Band Satcom And X-Band Radar Applications Development of Small-Molecule Organic EL Display Panels Achieves Lifetime of 60K1 Hours and the World's Highest-Level Performance Toshiba Matsushita Display Technology Co., Ltd. working in joint development with Idemitsu Kosan Co., Ltd. completes organic EL element featuring low power consumption and extended lifetime Toshiba DTMOS II Family Of 600V Power MOSFETs Use Superjunction Structure To Increase Power Efficiency First 512GB Multi-Level Cell Solid State Drives

2009   Toshiba Matsushita Display Technology Previews Integration Of High Resolution 3D Capabilities Into Handheld Devices at CES Toshiba Adds Family of High-Voltage Power MOSFETs Toshiba, and its technology partner SanDisk, announced the world's smallest 32nm 3-bit NAND flash chip at ISSCC 2009, with a die size of 113mm2