FFSA utilizes the innovative metal-configurable standard cell (MCSC) SoC platform technology for the design of ASICs and ASSPs and the seamless replacement of FPGAs.
FFSA significantly reduces time to market and non-recurring engineering (NRE) costs by minimizing customizable mask layers while delivering the advantages of performance, power and lower unit cost associated with standard-cell ASICs.
Require smaller volumes and quick turnaround times? Need to make frequent changes without large re-spin costs?
FFSA technology bridges the gap between:
*These benchmarks were created by Toshiba based on internal calculations comparing size, power and performance to competitive FPGAs.
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Toshiba, a premier semiconductor manufacturer, has provided leading companies with custom SoCs/ASICs for over three decades. Toshiba customers benefit from:
The new Toshiba Fit Fast Structured Array (FFSATM) technology can further help Toshiba customers differentiate their products from the competition by significantly reducing design cycles, project costs and power budgets while improving performance.
Q. What is the difference between this product and structured ASICs that were available in the market a few years ago?
A. Toshiba's FFSA has achieved significant improvements in die size, routability, performance and power as compared to the structured ASICs that were designed a few years ago.
Q. How do NRE charges compare?
A. NRE for FFSA is up to 5 times lower* than for standard-cell ASICs without compromising unit cost, performance or power.
Q. How fast is turnaround time?
A. Turnaround time is as little as 6 weeks** from receipt of a clean RTL to prototype delivery.
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*Five times lower NRE for FFSA is based on FFSA NRE charges (65nm) compared to NRE charges for standard Cell ASICs that range from $1.5 million to $3 million.
**Six weeks from RTL to proto is based on receiving clean RTL.
The key features of FFSATM are as follows:
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