"Limited Space, Maximum Functionality," Embedded Computing Design October 01, 2007.
According to this article, embedded computing systems designers are often tasked with putting as much functionality into a space -challenged device as possible, whether that device is a chip, board, or system. Trying to determine which products might give the most bang for the space available in the embedded computing element can be quite difficult. The special feature discussed functional density including considerations such as weight, size and life-cycle cost as some of the most crucial factors. The article also stated that chip designers have their own challenges in the area. "No one magic answer or solution exists when it comes to creating a functionally dense component, platform or system," stated Rakesh Sethi, PhD, director of business development in the Custom SoC and Foundry Business Unit at Toshiba America Electronic Components.
High-k Push Brings High Anxiety as 32 nm Looms, EETimes, December, 17, 2007
Article Excerpt:
Based on input from our customers, the demand for high-k materials only arises when working with process technologies below 32 nm. At larger process nodes, the benefits of using high-k materials are unclear, so therefore we have not experienced any customer demand," said Rakesh Sethi, director of business development for the Custom SoC and Foundry Business Unit at Toshiba America Electronic Components Inc. (Irvine, Calif.).
See EETimes website for complete article. |