300mm Fab: Cornerstone of Custom SoC World

Commercialization 1 to 2 Years Ahead of the Industry Directly Benefits Customers

Toshiba is able to commercialize leading-edge CMOS processes for advanced ICs one to two years ahead of the industry, to the direct benefit of our 300mm manufacturing customers. By leading the industry in producing high-performance system-level ICs in 90nm since 2003, plus early production of 65nm—with co-development of 45 and 32nm process technologies underway—Toshiba is able to stay ahead of the yield curve. We're continually solving DFM complexities to enhance performance, streamline time-to-revenue and reduce IC cost.

To stay ahead of the industry roadmaps and better serve cost-sensitive applications, Toshiba:

• Ranking in the top worldwide semiconductor capital spending, Toshiba is also a leading patent holder ranking in U.S. patents overall
• Allocates consistent capital investments of about $2 billion annually
• Leverages close relationships with 300mm tool vendors, like Canon and Nikon
• Serves volume customers that lead their industries and require differentiated products

Your design benefits many ways, because we reliably deliver:

• Reduced tooling cost through a select IP offering, allowing turnkey test and logistics
• Defect density at least one year ahead of industry; ideal for processor or FPGA
• Unparalleled Resolution Enhancement Technique (RET) for greater first time yield
• Ability to integrate low-power embedded DRAM
• Access to key IP, such as MIPS or ARM
• World-class yield management and DFM methodology
• Fully characterized spice models and extraction data across all corners: drc/lrc/erc
• Complete product testing and logistics management
• Flexible business model with seamless interface of 3rd party assembly, substrate or test

	Flexible business model with seamless interface of 3rd party assembly, substrate or test View >>

Manufacturing Process Nodes

Our CMOS technology offering includes legacy processes from 0.8µm, demonstrating Toshiba’s deep support of customer specificity in product cycle needs. We also ensure full upgrade compatibility for meeting our customers’ future goals. Current processes (with co-development of 45 and 32nm underway) include:

Extensive Market Applications

Toshiba serves a wide range of customer applications including the digital consumer multimedia market, automotive, computing, wireless, and mobile/ networking segments of the communications market. We ensure performance, efficiency and cost advantage for mid- to high-volume customers like Sony who require hyper-competitive technologies that are ideal for high-density, high-speed system solutions as well as low-power applications. Toshiba also manufactures high-performance field programmable gate array (FPGA) products for Xilinx, the world's leading supplier of programmable logic solutions.

Complete Engineering Services

Toshiba offers R&D, Design Analysis, guidance on DFM Analysis, Process and Modeling, Package and Substrate Design Services, Mask Making and Wafer Fabrication, Yield Management and Wafer Test, Die Test, Bumping and Assembly House interface.

Optimization Study Audits Your Company’s Current Foundry Engagement

Ask us to conduct an optimization study to audit your company’s current foundry engagement. See why global leaders choose Toshiba for a complete business solution. Our ability to work with technologies 1 to 2 years ahead of the industry, allows you to see around corners.

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