Toshiba's State-of-the-Art, 300-mm Wafer Manufacturing Plant

Located at Oita, in Kyushu, Japan.

Flexible Engagement: Hyper-Custom New Foundry Model

Foundry/COT

Advance CMOS Fabs are Cornerstone of Toshiba ASIC, Foundry and COT Business

Toshiba aggressively brings leading-edge CMOS processes for advanced ICs in 300mm manufacturing for its customers. By leading the industry in producing high-performance system-level ICs in 90nm since 2003, plus production of 65nm-with libraries now available for 40nm and 32/28nm process technologies underway-Toshiba is able to stay ahead of the yield curve. We're continually solving DFM complexities to enhance performance, streamline time-to-revenue and reduce IC cost.

To stay ahead of the industry roadmaps and better serve cost-sensitive applications, Toshiba:

Continues to invest and plans a multi-billion dollar investment in Capex and R&D over the next several years.
Has achieved many firsts and has been granted 1603 utility patents in 2008 (U.S. Patent Office - 2008).
Maintains its leadership position and ranks 3rd in worldwide semiconductor revenue (Gartner, 2009 Ranking, January, 2010), only after Intel and Samsung, following a recent acquisition of the Sony semiconductor business.

Your design benefits many ways, because we reliably deliver:

Ample capacity with multiple 300mm state-of-the-art facilities in Oita and Nagasaki. The Nagasaki Fab was acquired in early 2008 from Sony.
Reduced tooling cost through a select IP offering, allowing turnkey test and logistics
Defect density at least one year ahead of industry; ideal for processor or FPGA
Unparalleled Resolution Enhancement Technique (RET) for greater first time yield
Ability to integrate low-power embedded DRAM
Access to key IP, such as MIPS or ARM, SERDES-based IPs and a lot more
World-class yield management and DFM methodology
Fully characterized spice models and extraction data across all corners: drc/lrc/erc
Complete product testing and logistics management
Flexible business model with seamless interface of 3rd party assembly, substrate or test


	Flexible business model with seamless interface of 3rd party assembly, substrate or test View >>

Manufacturing Process Nodes

Our CMOS technology offering includes legacy processes from 0.8µm to 65nm and beyond, demonstrating Toshiba’s deep support of customer specificity in product cycle needs. We also ensure full upgrade compatibility for meeting our customers’ future goals. Current processes (with co-development of 40nm, 32/28nm underway) include:

• ASIC 40nm

• ASIC 65nm

• ASIC 90nm

• ASIC 0.11µm

• ASIC 0.14µm

• ASIC 0.25µm

Extensive Market Applications

Toshiba serves a wide range of customer applications including the digital consumer multimedia market, automotive, computing, wireless, and mobile/ networking segments of the communications market. We ensure performance, efficiency and cost advantage for mid- to high-volume customers like Sony who require hyper-competitive technologies that are ideal for high-density, high-speed system solutions as well as low-power applications. Toshiba also manufactures high-performance field programmable gate array (FPGA) products for Xilinx, the world's leading supplier of programmable logic solutions.

Complete Engineering Services

Toshiba offers R&D, Design Analysis, guidance on DFM Analysis, Process and Modeling, Package and Substrate Design Services, Mask Making and Wafer Fabrication, Yield Management and Wafer Test, Die Test, Bumping and Assembly House interface.

Optimization Study Audits Your Company’s Current Foundry Engagement

Ask us to conduct an optimization study to audit your company’s current foundry engagement. See why global leaders choose Toshiba for a complete business solution. Our ability to work with technologies 1 to 2 years ahead of the industry, allows you to see around corners.

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