| engineers understand evolving custom SoC design issues
and support their product planning
decisions. The company invites designers
to tap into this deep system-level
expertise to enable higher productivity
and greater success.
The new Multi-VDD technical paper
can be accessed and downloaded from here
*About TAEC
Combining quality and flexibility
with design engineering expertise,
TAEC brings a breadth of advanced,
next-generation technologies to its
customers. This broad offering includes
memory and flash memory-based storage
solutions, a broad range of discrete
devices, displays, medical tubes,
ASICs, custom SOCs, microprocessors,
microcontrollers and wireless components
for the computing, wireless, networking,
automotive and digital consumer markets.
TAEC is an independent operating
company owned by Toshiba America,
Inc., a subsidiary of Toshiba Corp.
(Toshiba), Japan 's largest semiconductor
manufacturer and the world's fourth
largest semiconductor manufacturer.
In more than 130 years of operation,
Toshiba has recorded numerous firsts
and made many valuable contributions
to technology and society. For additional
company and product information,
please visit TAEC's website at chips.toshiba.com. For
technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.
Information in this press release,
including product pricing and specifications,
content of services and contact information,
is current and believed to be accurate
on the date of the announcement,
but is subject to change without
prior notice. Technical and application
information contained here is subject
to the most recent applicable Toshiba
product specifications. In developing
designs, please ensure that Toshiba
products are used within specified
operating ranges as set forth in
the most recent Toshiba product specifications
and the information set forth in
Toshiba’s “Handling Guide
for Semiconductor Devices,” or “Toshiba
Semiconductor Reliability Handbook.” This
information is available at chips.toshiba.com
or from your TAEC representative.
All trademarks and tradenames used
herein are the properties of their
respective holders and may be registered
in certain jurisdictions.
All trademarks and tradenames used
herein are the properties of their
respective holders.
ASIC 07 475
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