ASIC Packaging Overview

There are a number of factors to consider when selecting an optimal package configuration: I/O requirement, package footprint/form factor, thermal dissipation, electrical performance, and cost—to name a few. With ASICs now being introduced exceeding 16-million gate and operating at clock frequencies of 250 MHz and beyond, accurate package data and selection is critical. To meet system-level performance and density requirements, packages with better thermal and electrical characteristics that do not impact the performance of the die are needed.

New advanced packaging technologies, such as Chip Scale Package (CSP) are currently available to meet the ever-increasing market demand for smaller size, more I/Os, and lower cost. Toshiba offers a broad and varied range of package options for all ASIC families to suit all applications. Whether your design requires a 16-lead DIP or 2304-PBGA[FC], Toshiba offers expert guidance and innovative solutions to help you achieve your design goals.

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