Mr. Sakaida, who assumed the office of president and CEO in March 2007, has been with Toshiba Corporation since 1978 and previously served as managing director, Toshiba Electronics Asia (Singapore) Pte Ltd., with responsibility for sales and marketing to customers throughout Asia and India. Earlier, Mr. Sakaida held key positions in International Operations, Electronic Components, for Toshiba Corp., in which he was responsible for semiconductor sales to leading global manufacturers. He has also held many strategic planning and sales management positions through out his career with Toshiba, with responsibility at various times for memory ICs, batteries and displays.

Mr. Marlow was appointed to the position of executive vice president in November 2000. He has held several positions with Toshiba since he began his employment with the company in 1980. Most recently, Mr. Marlow held the dual roles of senior vice president of demand generation responsible for Toshiba sales activities, and vice president of the memory business unit for the Semiconductor Group of Toshiba, which included product marketing responsibilities for all DRAM, SRAM, and flash memory products, memory engineering.

Mr. Yamaguchi was appointed to the position of senior vice president of the System LSI Group in April 2005. He is responsible for directing sales, marketing and SoC engineering for the Custom SoC and Foundry and ASSP business units. As well, he oversees the SoC Design Centers, Design Solution Group, and other dedicated support functions. Mr. Yamaguchi has been with Toshiba Corporation since 1982, most recently as the senior manager and head of the Americas Group. He has over 23 years of involvement in overseas market activity, including time spent in Europe, the U.S. and Asia.

Clayton Bond is senior vice president of the Display Devices and Components Business Unit (DDC BU) of Toshiba America Electronic Components, Inc (TAEC). His responsibilities include overseeing the direct strategic marketing and applications engineering of the DDC BU, which includes LCD and OLED displays, medical and industrial tubes, and the Advanced Technology Group, with emerging technologies including Direct Methanol Fuel Cells. Mr. Bond has held several positions at TAEC. He began as a sales engineer of the Electron Tube and Device Division (ETD), then become manager of sales and marketing, and later director of sales and marketing for the ETD group.

Mr. Kazi is senior vice president and technology executive for the System LSI Group at Toshiba America Electronic Components, Inc. (TAEC). Mr. Kazi is responsible for Toshiba's Application Specific Standard Products (ASSP) business unit. His responsibility includes strategic marketing, engineering and managing its performance, and operation. As a technology executive, he oversees the entire SLG engineering effort including ASSP engineering, Design Centers for Custom SoC and Foundry, and the Design Solution Group. Formerly he was the vice president of the Microprocessor Business Unit for TAEC and prior to that he was chief operating officer and vice president at ArTile Microsystems, Inc., a TAEC spin-off.