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| Established |
1980 |
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| Executive
Officers |
- Hideya Sakaida, president and
CEO
- Stephen Marlow, executive vice president
- Hideya Yamaguchi, executive vice president, System LSI
Group
- Shardul Kazi, senior vice president and technology executive, System LSI Group
- Clayton Bond, senior vice president,
Display Devices and Components Business
Unit
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| Employees |
Approximately 500 |
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| Corporate
Profile |
Toshiba is the heartbeat within market-leading designs. Working closely with design engineers to navigate and define the ever-changing need for innovation, Toshiba Corp. (Toshiba) and its subsidiary in the Americas, Toshiba America Electronic Components, Inc. (TAEC), deliver value-added solutions with conviction, passion and artistry. Toshiba fosters long-lasting relationships with OEMs, ODMs, CMs, distributors and fabless chip companies, and is committed to enabling product breakthroughs with advanced, reliable electronic components and responsive technical support. With seamless design and manufacturing of high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoC/ASICs, digital multimedia and imaging products, microcontrollers and wireless components, Toshiba makes possible today's leading cell phones, digital music players, cameras, medical devices, TVs, automotive electronics and more. |
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| Parent
Company |
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer
(Gartner, 2008 WW Semiconductor Revenue Estimate, April 2009)
 Toshiba America, Inc.: approximately 8,000 employees in the U.S.
Toshiba Corporation:
Toshiba Corporation: 199,000 employees (as of March 31, 2008). Consolidated annual net sales US $67.9 billion (FY2008)1 . More than 300 major subsidiaries and affiliates worldwide. Ranks 7th on the Fortune Electronic/Electrical Equipment; 91st on the Fortune Global 500 (Fortune.com, 2008).
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| Locations |
Headquarters
Toshiba America Electronic Components
19900 MacArthur Blvd, Ste 400
Irvine, CA 92612
Phone: 949-623-2900 |
Other
Offices
Bloomington, MN
Buffalo Grove, IL
Duluth, GA
Plano, TX
Marlborough, MA
San Diego, CA
Parsippany, NJ
Wixom, MI |
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System
LSI Group
Toshiba America Electronic Components
2590 Orchard Parkway
San Jose, CA 95131
Phone: 408-526-2400 |
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| Product
Overview |
Toshiba offers a broad range of enabling technology solutions that allow OEMs, ODMs, CMs and fabless chips companies to develop advanced integrated products for the computing, networking, communications, digital consumer, automotive and other markets. Focused offering includes: memory, components, displays, custom chips and foundry services.
View |
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| Product
Gallery |
To accommodate ever-increasing demand for market- and application-specific products, Toshiba's portfolio consists of hundreds of items organized into upwards of 20 product categories. Representative images of many categories are available for download. View |
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| WHAT
DISTINGUISHES TOSHIBA CORPORATION |
| Commitment to innovative, advanced technology |
- Toshiba is a leading patent holder, with 1,603 registered in the United States in 2008 (U.S. Patent Office).
- Extensive investment in the Electronic Devices business with combined
in excess of $1 billion planned for FY20093.
- A principal innovator of Flash memory.
- Advanced process technologies enable 70 nanometer (nm), 56nm and 43nm memory devices and 90nm and 65nm custom chips with availability of 40nm libraries for ASIC and COT customers.
- Co-developer of the Cell Processor with IBM and Sony.
- A world leader in innovative fuel-cell technology for handheld electronic devices.
- A leader in high-quality CMOS image sensors for camera-enabled cellular phones and chip-scale camera modules (CSCM).
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| Commitment
to high-quality, reliable products |
- The foundation of Toshiba's business is to provide quality products and services on time to its customers. This goal is supported by Toshiba's policy and basic commitment and core values of service, continual improvement, communications and teamwork with integrity.
- Consistent support of quality standards and achievement of ISO9001/2008 Certification.
- Strict adherence to advanced DFM rules and a seamless design and manufacturing process produces high manufacturing yields and low defect densities.
- Receipt of number customer quality awards including the Zero Defect Award received from Federal-Mogul Corporation and others.
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| Commitment
to responsive technical and
design support |
- TAEC operates three design centers in the U.S., and Toshiba has a network of design centers and technical support worldwide.
- World-class distributors with strong customer support organizations can service Toshiba customers worldwide. These distributors include Avnet, Inc., Arrow Electronics, Inc., DigiKey, Mouser Electronics, Nu Horizons Electronics Corp. and others.
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| RECENT
COMPANY ACCOMPLISHMENTS |
| With more than 130 years of operation, Toshiba has recorded numerous firsts and has made many valuable contributions to technology and society. Key recent milestones include: |
- Toshiba announces the first 512GB MLC NAND solid state drive for the mobile computing market and other applications (12-16-08)
- Toshiba remains the top discrete semiconductor supplier in terms of revenue, a position it has held since 1986, according to Gartner. (4-08)
- Toshiba expands its custom chip business with a new Virtual Prototyping tool that lowers design risk by enabling concurrent co-design of a chip, package and system, the availability of 40nm libraries, and new foundry and COT customers.
- Toshiba and SanDisk announce sampling of 16Gb 43nm MLC NAND (2-7-08).
- Toshiba reveals strategic initiative for mobile handset market to speed time-to-market with flexible, modular analog peripheral and mixed-signal building blocks. Over the last year, Toshiba has expanded its product portfolio with I/O expander ICs, an MDDI LCD controller, CMOS image sensors and compact modules for mobile applications. (08)
- TAEC introduces a family of MLC NAND based solid state disk drives (12-10-07).
- Toshiba introduces its first commercial GaN semiconductor, a 50W, X-band HEMT for radar and medical applications (6/5/07), and achieved one of the highest levels of output power in a Ku-band GaN device: 65.4W at 14.5GHz. (10-9-07)
- Toshiba and SanDisk mark the opening ceremony for a second 3 00 mm wafer fab at Toshiba's Yokkaichi Operations, due online in Q407 to meet fast growing demand for NAND flash memory (9/04/07).
- TAEC and TMD announced an expanded line-up of RoHS-Compatible4 industrial LCD displays, including an ultra high-luminance 12.1-inch SVGA LCD for outdoor use (5/9/07).
- The Toshiba 16Gb NAND TSOP are the highest density, single-chip NAND devices available to date, fabricated with cutting-edge 56 nm process technology (1/23/07).
- Toshiba unveils high-density solutions to simplify integration of high-capacity MLC NAND in embedded applications (1/8/07).
- Toshiba expands its custom chip business with a new Virtual Prototyping tool that lowers design risk by enabling concurrent co-design of a chip, package and system, the availability of 40nm libraries, and new foundry and COT customers.
- Toshiba significantly expands capacity with the purchase of Sony's 300-mm Fab in Nagasaki, Japan for the production of high-performance custom SoCs and semiconductors including products for the SCEI PlayStation gaming system, as well as capacity for Foundry services.
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