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TOSHIBA EXPANDS DYNASTRON™ CMOS
IMAGE SENSOR LINE-UP WITH 3.2-MEGAPIXEL CHIP
Adoption of New Higher Resolution Devices
in High-End Camera Phones Expected to Spur Displacement of
Low-End Digital Still Cameras
SAN JOSE, Calif.,
September 27, 2005 -- Toshiba America Electronic
Components, Inc. (TAEC)* today announced the further expansion
of its industry-leading Dynastron™ complementary metal
oxide semiconductor (CMOS) image sensor product line with
the addition of a new 3.2-megapixel CMOS image sensor chip.
Designated ET8E99-AS, the new chip has a small 2.7-micron
(um) pixel pitch with a 1/2.6-inch optical format and incorporates
an analog-to-digital (A/D) converter. Combining superb picture
quality with low-power consumption, it is targeted at high-end
camera-enabled mobile handset applications. Toshiba Corporation
(Toshiba) will be exhibiting the ET8E99-AS at CEATEC JAPAN
2005 being held from October 4 to October 8 at Makuhari Messe.
"With the launch of the new 3.2-megapixel ET8E99-AS
CMOS image sensor, we can meet cell phone manufacturers'
high-end camera phone requirements for a small device with
excellent image quality and low-light performance. This advancement
heralds the real start of camera phones competing directly
with and displacing low-end digital still cameras," said
Andrew Burt, director of the Wireless Business Unit at TAEC. "Concurrently
we project continued strong demand for our existing complement
of 2-megapixel, 1.3-megapixel and VGA-resolution Toshiba
Dynastron CMOS image sensors. Our customers tell us that
Toshiba satisfies a critical need with its ability to support
the full range of market requirements across resolution sizes
in production volumes."
The ET8E99-AS CMOS image sensor is an area color image sensor
that incorporates an A/D converter in non-diced wafer form.
It achieves approximately 3.2 megapixels of array resolution
in a small 1/2.6-inch optical format with reduced pixel pitch
of 2.7um and a pixel size sufficient to record detailed,
high-resolution images. It also offers low-power consumption,
smearless imaging and high-speed operation.
Other Features
Other features include the following:
- In video mode, capable of a high-speed frame rate
of 15 frames per second (fps) at QXGA output and
30fps at 3-to-1 vertical pixel binning
- To support simplified design of an optimized camera
system, incorporates automatic blemish correction
and detection, gain control and lens shading compensation
- To support a flexible input clock, incorporates
a phase locked loop circuit
- Can use with a companion Toshiba image signal processor
(ISP) chip that provides YUV or JPEG encoded data
or employ another suitable external ISP chip
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Toshiba Dynastron CMOS Image Sensors
Toshiba is a pioneer and recognized leader in the development
of CMOS image sensors with core competencies in advanced sensor
technology and sophisticated signal processing technology.
Toshiba Dynastron CMOS image sensors employ a special square
pixel design that enables them to achieve CCD-quality images
with low-power consumption, even in low-light conditions. Dynastron
CMOS image sensors have proven their superiority in image quality
comparisons by offering demonstrably better color balance and
picture quality.
Toshiba currently offers the TCM8230MD VGA camera module,
the TCM8240MD 1.31-megapixel camera module, and the ET8EA3-AS
2-megapixel and new ET8E99-AS 3.2-megapixel CMOS image sensor
chips. The company is continuing to develop devices that
combine smaller pixel sizes with higher resolution.
Pricing and Availability
Samples of the ET8E99-AS are currently available with mass
production planned for the end of 2005 at a monthly output
rate of 300,000 units or greater. Sample pricing is $45.00
each based on a quantity of 1,000 pieces per year.
Technical Specification Summary
| Part Number |
ET8E99-AS |
| Optical Format |
1/2.6 inch |
| Pixel Count |
2,080 (H) x 1,560 (V) maximum |
| Pixel
Pitch |
2.7um (H) x 2.7um (V) |
| Output Signal |
RAW data: 12-bit parallel/subLVDS serial |
| Clock Frequency |
6MHz to 20MHz |
| Frame Rate |
15fps at QXGA output
30fps at 3-to-1 vertical pixel binning |
| Interface Control |
I2C bus |
| Power Supply |
1.5±0.1 volts (V) digital
2.8±0.2V analog and I/O |
| Power Consumption |
240mW at 15fps QXGA output |
| Operating Temperature |
-20º - 60°C |
| Functionality |
Digital zoomed VGA image in combination
with an external processor, automatic blemish detection
and correction, lens shading compensation, support for
programmable drive strength, variable electronic shutter,
variable gain control, built-in feedback clamp |
| Package |
Non-diced wafer |
*About TAEC
Combining quality and flexibility with design engineering
expertise, TAEC brings a breadth of advanced, next-generation
technologies to its customers. This broad offering includes
memory and flash memory-based storage solutions, a broad
range of discrete devices, displays, medical tubes, ASICs,
custom SOCs, microprocessors, microcontrollers and wireless
components for the computing, wireless, networking, automotive
and digital consumer markets.
TAEC is an independent operating company owned by Toshiba
America, Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan's
second largest semiconductor manufacturer and the world's
ninth largest integrated manufacturer of electric and electronic
equipment. In almost 130 years of operation, Toshiba has
recorded numerous firsts and made many valuable contributions
to technology and society. For additional company and product
information, please visit TAEC's website at chips.toshiba.com.
For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.
Information in this press release, including product pricing
and specifications, content of services and contact information,
is current and believed to be accurate on the date of the
announcement, but is subject to change without prior notice.
Technical and application information contained here is subject
to the most recent applicable Toshiba product specifications.
In developing designs, please ensure that Toshiba products
are used within specified operating ranges as set forth in
the most recent Toshiba product specifications and the information
set forth in Toshiba's "Handling Guide for Semiconductor
Devices," or "Toshiba Semiconductor Reliability
Handbook." This information is available at ,
or from your TAEC representative.
All trademarks and tradenames used herein are the properties
of their respective holders. Dynastron is a trademark of
Toshiba Corporation.
WRLS 05 293
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