TOSHIBA TO LAUNCH NEW U3 SMART USB FLASH DRIVE SERIES

High Functioning U3™ Smart Drive Computing Platform Series to ship in Q4

IRVINE, Calif., and TOKYO, August 29, 2006—Toshiba America Electronic Components, Inc., (TAEC)* and its parent, Toshiba Corporation, today announced the forthcoming introduction of TransMemory™ USB Flash Drives that will bring U3 smart technology into the company’s USB lineup. The four models in the TransMemory™ U3 smart drive series will be launched on the global market at the end of November. A corresponding line-up of Flash drive subassemblies for OEMs will be offered that can be easily customized by adding the outer shell.

USB flash drives have won support for their combination of capacity, ease-of-use and portability. The U3 smart drive computing platform extends that

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versatility by supporting storage not only of data, but also of applications and personal computer settings, preferences, profiles and security features, as well as the means to manage them. A U3 smart drive can be used in any Windows 2000 or XP PC with a USB slot, and once configured to suit a user’s preferences, delivers the user’s familiar computing environment and support for such applications as e-mail and web surfing, and access to files stored both on the host PC and on the smart drive. When the user removes the U3 smart drive, no personal data is left behind.

On insertion into a PC, all U3 smart drives automatically launch the U3 Launchpad, which presents the user with a list of programs to choose from and files to work with. U-Safe password-based security protection software is also built into the U3 Launchpad and can be activated at the user’s discretion. U3 smart software programs can be downloaded directly through the U3 Launchpad on every U3 smart drive, or from the U3 online store at http://software.u3.com.

The new TransMemory™ series will be exhibited at IFA 2006, the world's largest consumer electronics trade fair, which will be held in Berlin, Germany, from September 1 to 6, 2006.

“Toshiba’s new USB U3 smart drive series offers a high level convenience and portability by enabling users to carry U3 smart programs and content together on a single U3 smart drive and access them on most Windows-based PCs to maintain a familiar personal workspace,” said Scott Nelson, director, memory marketing, for TAEC.

"Toshiba is a recognized global leader in consumer electronics," said Esther Kruijver, VP Platform for U3. "Their support for the U3 platform underscores the growing popularity of U3 smart drives among consumers worldwide. IFA Berlin is the ideal venue to introduce Toshiba’s exciting new family of U3 smart drives."

Outline of New Products

Name of Product	Part No.	Capacity	Market Launch
TransMemory™ (U3™ smart drive computing platform)	U2H-512MT	512MB¹	Late November
	U2H-001GT	1GB²
	U2H-002GT	2GB
	U2H-004GT	4GB

Background and Aim of Development

The USB flash memory market is growing and moving to support advanced functions along with larger memory capacities. In order to meet market demands, Toshiba will expand its line-up with these U3 smart USB flash drives.

Key Features

1. TransMemory™ (U3 smart platform)
- Support for the U3 smart drive computing platform.
- Integrates “U-Safe,” a password security system, in U3 Launchpad.
- U3 Launchpad supports downloads of U3 smart software applications directly from the U3 smart drive or from the U3 online store at http://software.u3.com.
- Cap cord to prevent loss of cap.

Specifications (revised 10/27/06)

Name of Product	TransMemory™
Capacity	512MB, 1GB, 2GB and 4GB
U3 smart platform Support	Supported
Compatible Interface	USB1.1/USB2.0 Hi-Speed compatible³
Power Supply Voltage	Bus powered from USB port
Exterior Dimensions	62.5(L)×17.5(W)×8.5(H)mm
Weight Approx.	9g (main body only)
Operating Environment	Operating Temperature: 0 – 50 degrees C Keeping Temperature: -20 – 60 degrees C Operating and Keeping Humidity: 20 – 95%RH (non condensing)
Compatible PC Models	U3™ USB interface (Type A) with Windows® 2000sp4 and beyond or Windows (R) XP; as removable disk

NAND Flash Background

As a recognized pioneer in flash technology, Toshiba was a principal innovator of NAND- and NOR-type Flash technology in the 1980’s. Toshiba maintains leadership in Flash technology today, with a complete line of NAND memory in densities from 512 megabit⁴ (Mb) to 16Gb⁵ to meet various application requirements. NAND Flash has become one of the leading technologies for solid-state storage applications because of its high-speed programming capability, high-speed erasing, and low cost. The sequential nature (serial access) of NAND-based Flash memory provides notable advantages for these block-oriented data storage applications. Toshiba’s NAND Flash memory products are optimized for general solid-state storage, image file storage and audio for applications such as solid-state disk drives, digital cameras, audio appliances, set-top boxes and industrial storage.

*About TAEC

Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes memory and flash memory-based storage solutions, a broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless components for the computing, wireless, networking, automotive and digital consumer markets.

TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan’s largest semiconductor manufacturer and the world’s fourth largest semiconductor manufacturer. In more than 130 years of operation, Toshiba has recorded numerous firsts and made many valuable contributions to technology and society. For additional company and product information, please visit TAEC’s website at chips.toshiba.com. For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com.

¹When used herein in relation to memory density, megabyte and/or MB means 1,024x1,024 = 1,048,576 bytes. Usable capacity may be less. For details, please refer to specifications.
²When used herein in relation to memory density, gigabyte and/or GB means 1,024x1,024x1,024 = 1,073,741,824 bytes. Usable capacity may be less. For details, please refer to specifications.
³USB2.0 Hi-Speed is the name of a compatible standard and is not intended to indicate a particular operating speed.
⁴ When used herein in relation to memory density, megabit and/or Mb means 1,024x1,024 = 1,048,576 bits. Usable capacity may be less. For details, please refer to specifications.
⁵When used herein in relation to memory density, gigabit and/or Gb means 1,024x1,024x1,024 = 1,073,741,824 bits. Usable capacity may be less. For details, please refer to specifications.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba’s “Handling Guide for Semiconductor Devices,” or “Toshiba Semiconductor Reliability Handbook.” This information is available at www.chips.toshiba.com, or from your TAEC representative.

* U3™ is a trademark of U3 LLC.
* TransMemory™ is a registered trademark of Toshiba Corporation.

All other trademarks and tradenames held within are the properties of their respective holders.

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