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Toshiba Debuts SmartNAND, Latest Addition To NAND Flash Portfolio
New NAND Flash Embedded Products Integrate Robust Error Management; Simplify Design and Time to Market of Advanced NAND in Customer Applications
Toshiba SmartNAND
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IRVINE, Calif., April 5, 2011 Toshiba America Electronic Components, Inc., (TAEC)* today announced that it has enhanced its NAND flash portfolio with the introduction of SmartNAND™, its next-generation 24-nanometer (nm) NAND flash product family. The SmartNAND series integrates leading-edge 24nm process NAND flash technology with a control chip that supports error correction code (ECC) and is available in densities ranging from 4 to 64 gigabyte (GB).

The new series is expressly designed to remove the burden of ECC from the host processor, while minimizing protocol changes. SmartNAND simplifies the host-side design and application of advanced NAND technology in a range of applications including portable media players, tablet PCs, digital TVs, set-top-boxes, and other devices that require high-density, non-volatile memory.

Market demand continues to grow for high density chips that support high resolution video and enhanced storage, and Toshiba is an established innovator in this key area. The introduction of SmartNAND reinforces its leadership position.

"Toshiba's new SmartNAND will provide our customers a smoother design experience into 24nm generation and beyond," noted Scott Nelson, vice president, Memory Business Unit, Toshiba America Electronic Components, Inc. "By enabling the system designer to directly manage the NAND using a standard or custom host NAND controller, while leaving the function of error correction within the NAND package, SmartNAND results in faster time to market, access to leading geometries and potentially lowers design costs when compared to conventional NAND flash implementations with external ECC."

The new SmartNAND 24nm product lineup is a replacement for current 32nm generation devices. Its advanced process combined with a faster controller and internal interface achieves faster read and write speeds and enhances overall performance. Optimized to suit design objectives, SmartNAND supports a range of read and write speeds including four read modes and two write modes.

Utilizing the long established raw NAND interface, the SmartNAND family includes new features that are optimized for high-capacity and high-performance applications. Managing bit errors is essential so that digital products can maintain acceptable levels of performance and reliability. The integration of error management with the NAND device, in a single package, allows Toshiba's customers to take advantage of high capacity, advanced flash memory solutions that offer excellent error management.

Samples of the new SmartNAND family are available in mid-April and mass production will begin in the second quarter of CY2011 (April to June).

Product Number Capacity Package Start of samples Start of mass production
THGVR1G5D1HTA00 4GB 48 pin TSOP May, 2011 2Q, 2011
THGVR1G5D1HLA09 52 land LGA August, 2011 3Q, 2011
THGVR1G6D1GTA00 8GB 48 pin TSOP April, 2011 2Q, 2011
THGVR1G6D1GLA09 52 land LGA July, 2011 3Q, 2011
THGVR1G7D2GTA00 16GB 48 pin TSOP September, 2011 4Q, 2011
THGVR1G7D2GLA09 52 land LGA May, 2011 2Q, 2011
THGVR1G8D4GLA09 32GB 52 land LGA June, 2011 3Q, 2011
THGVR1G9D8GLA09 64GB 52 land LGA August, 2011 3Q, 2011
Key Features

 

  1. The integrated error correction (ECC) and leading edge 24nm process generation allows for enhanced speed performance of 1.9 times faster read speed and 1.5 times faster write speed than the current lineup.
  2. Toshiba's SmartNAND offers a range of read and write speeds to vary optimized speed performance; the read speed will be available in four options, and the write speed in two. Power save mode is also available for lower power requests.
  3. Toshiba's SmartNAND utilizes a standard raw NAND interface, allowing easy replacement of standard NAND. SmartNAND can be applied to existing host controllers with driver software support, if necessary. This simplifies system development, allowing manufacturers to minimize development costs and to improve time to market for new and upgraded products.
Product Specifications
Interface Standard NAND flash memory interface
Page Size 8K Byte
Voltage Vcc=2.7 ~ 3.6V
Read & Write Mode
  • 4 Type Read Mode, 2 Type Write Mode
  • Power Save Mode is applicable to all functions

Normal Mode & Reliable Mode

  • Normal Mode; MLC (2bit/Cell)
  • In reliable mode, it operates as pseudo SLC, and the host side can set the area in block or chip basis for normal mode or reliable mode.
Package
  • 48 pin TSOP (12mm x 20mm x 1.2mm)
  • 52 land LGA (14mm x 18mm x 1.0mm)
*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory -based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2009 WW Semiconductor Revenue, April 2010). For additional company information, please visit www.toshiba.com/taec. For more information on Toshiba memory products, please visit www.memory.toshiba.com.

 

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba’s "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.

SmartNAND is a trademark of TOSHIBA CORPORATION

 
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