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New Embedded NAND Flash Memory Devices from Toshiba Feature Toggle-Mode DDR NAND for Improved Performance
24nm e-MMC Boosts Performance, Reduces Costs, Makes Large Densities a Viable Option for Space-Conscious Devices
Toshiba 24nm eMMC
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IRVINE, Calif., July 27, 2011 Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has enhanced its NAND flash portfolio with the introduction of a family of higher performance 24-nanometer (nm) e-MMC™ devices. Greatly reducing the bottlenecks often encountered by single data rate NAND, the use of toggle-mode double data rate (DDR) NAND improves performance and enables faster random access and sequential performance. With densities ranging from 2-gigabyte1 (GB) to 128GB, these new embedded NAND flash memory modules feature the world's smallest geometry e-MMC, one of the highest capacities achieved in the industry, and offer full compliance with the JEDEC e-MMC Version 4.41 standard.

Toshiba's 24nm e-MMC process lowers costs, enables higher densities, boosts performance and allows for smaller packages – all of which are key requirements for space-conscious applications such as smartphones, tablet PC s, eBooks, digital video cameras, printers, servers, and POS systems.

Integrating up to 128GB NAND and an e-MMC controller in a single package, Toshiba's new family of 24nm e-MMC devices combine up to 16 pieces of 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's cutting-edge 24nm process technology. Toshiba was the first company to succeed in combining 16 pieces of 64Gbit die in e-MMC to achieve 128GB of memory by applying advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick. Full compliance with the JEDEC e-MMC Version 4.41 (V4.41) standard for embedded MultiMediaCards supports standard interfacing and simplifies product design-in, reducing development burdens on product manufacturers.

“The utilization of our new toggle-mode DDR NAND die at 64Gbit density is key to enabling our e-MMC to support the higher performance, and smaller, thinner packages that customers desire,” noted Scott Beekman, senior business development manager, mobile communications memory for TAEC. “For example, our 128GB e-MMC can now be supported in a smaller 14 x 18 package, which many space conscious applications can support.”

Key Features
  • Faster performance using toggle-mode DDR NAND.
  • The JEDEC e-MMC V4.41 compliant interface handles essential functions, including writing block management, error correction and wear leveling. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
  • A wide product line-up supports capacities from 2 GB to 128GB.
  • The 24nm 64Gbit die enables smaller e-MMC packages.
  • The new chips support the advanced partitioning and security of e - MMC V4.41. Multiple storage areas can be configured, including several enhanced memory areas for system files or code, and a multi-level cell (MLC) area for data storage.

Samples of 8GB, 16GB, 32GB and 64GB 24nm e-MMC product family are available now, and mass production will begin in Q3, with other densities to follow.

Density Package Start of samples Start of mass production
2GB 11.5x13.0x1.0mm 4Q11 1Q12
4GB 11.5x13.0x1.0mm 3Q11 4Q11
8GB 11.5x13.0x1.0mm Now 3Q11
16GB 12.0x16.0x1.2mm Now 3Q11
32GB 12.0x16.0x1.2mm Now 3Q11
64GB 14.0x18.0x1.2mm Now 3Q11
128GB 14.0x18.0x1.2mm 3Q11 4Q11
*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs.  Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc.   is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan 's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2010 WW Semiconductor Revenue, Jan. 2011 ). Toshiba was founded in 1875, and today operates a global network of more than 740 companies, with 204,000 employees worldwide and annual sales surpassing $77 billion.

For additional company and product information, please visit http://www.toshiba.com/taec/.

 

1Product density is identified based on the maximum density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application.

e-MMC is a trademark of the MultiMediaCard Association.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba’s “Handling Guide for Semiconductor Devices,” or “Toshiba Semiconductor Reliability Handbook.” This information is available at www.chips.toshiba.com, or from your TAEC representative.

 
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