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IRVINE, Calif., July 27, 2011 — Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has enhanced its NAND flash portfolio with the introduction of a family of higher performance 24-nanometer (nm) e-MMC™ devices. Greatly reducing the bottlenecks often encountered by single data rate NAND, the use of toggle-mode double data rate (DDR) NAND improves performance and enables faster random access and sequential performance. With densities ranging from 2-gigabyte¹ (GB) to 128GB, these new embedded NAND flash memory modules feature the world's smallest geometry e-MMC, one of the highest capacities achieved in the industry, and offer full compliance with the JEDEC e-MMC Version 4.41 standard.

Toshiba's 24nm e-MMC process lowers costs, enables higher densities, boosts performance and allows for smaller packages – all of which are key requirements for space-conscious applications such as smartphones, tablet PC s, eBooks, digital video cameras, printers, servers, and POS systems.

Integrating up to 128GB NAND and an e-MMC controller in a single package, Toshiba's new family of 24nm e-MMC devices combine up to 16 pieces of 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's cutting-edge 24nm process technology. Toshiba was the first company to succeed in combining 16 pieces of 64Gbit die in e-MMC to achieve 128GB of memory by applying advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick. Full compliance with the JEDEC e-MMC Version 4.41 (V4.41) standard for embedded MultiMediaCards supports standard interfacing and simplifies product design-in, reducing development burdens on product manufacturers.

“The utilization of our new toggle-mode DDR NAND die at 64Gbit density is key to enabling our e-MMC to support the higher performance, and smaller, thinner packages that customers desire,” noted Scott Beekman, senior business development manager, mobile communications memory for TAEC. “For example, our 128GB e-MMC can now be supported in a smaller 14 x 18 package, which many space conscious applications can support.”

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs.  Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc.   is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan 's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2010 WW Semiconductor Revenue, Jan. 2011 ). Toshiba was founded in 1875, and today operates a global network of more than 740 companies, with 204,000 employees worldwide and annual sales surpassing $77 billion.

For additional company and product information, please visit http://www.toshiba.com/taec/.