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Toshiba to Start Sales of White LED Packages
New product to use GaN chips manufactured on 200mm silicon wafers
Toshiba White LED Package
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TOKYO, Dec. 14, 2012 — Toshiba Corporation (Tokyo: 6502) today announced that the company will start sales of white light-emitting diode (LED) packages that offer makers of general purpose and industrial LED lighting solutions a cost-competitive alternative to current LED packages. Mass production will start this month.

Production of LED chips is typically done on 2- to 4-inch wafers with an expensive sapphire substrate. Toshiba and Bridgelux, Inc. have developed a process for manufacturing gallium nitride LEDs on 200mm silicon wafers, which Toshiba has brought to a new production line at Kaga Toshiba Electronics Corporation, a discrete products manufacturing facility in northern Japan. Mass production of packages using the new line's output starts this month.

Deployment of Toshiba and Bridgelux's new gallium nitride-on-silicon (GaN-on-Si) technology to produce LED chips has allowed Toshiba to replace sapphire substrates and to produce the chips on a much more cost-competitive silicon substrate.

The low power consumption and long life of the white LED lighting is winning wide adoption in general purpose lighting, TV backlighting and other areas of application. In FY2011 the global market stood at 700 billion yen (approximately US$8.5 billion) and it is expected to almost double to 1,250 billion yen ($15.2 billion) in FY2016.

Going forward, Toshiba will promote product development and global sales toward securing a 10% share of the world market in FY2016.

Product Outline
Product name: TL1F1 series (1W)
Size: 6.4 mm (L) x 5.0 mm (W) x 1.35 mm (H)
Light flux: 112 lm (at 350mA)
Mass Production start: December 2012
Production capability (planned): Cell Content 10,000,000 units per month
**About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer Gartner, 2010 WW Semiconductor Revenue, March 2012). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

 

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook."

 

Editors Note: Reader inquiries please publish: Tech.Questions@taec.toshiba.com.

 
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