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Achieves Lowest Output Current in the Industry at 2.5A with an SO6 Package

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IRVINE, Calif., Feb. 12, 2013 — Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, has announced the addition of the TLP152, an SO6-package IC coupler that can directly drive a middle-capacity IGBT or power MOSFET. Due to its ability to contribute to a possible reduction of mounting area by approximately 50 percent over previous offerings, the TLP152 can be used in a wide range of products for which downsizing is increasingly demanded, including photovoltaic power micro inverters, digital home appliances, industrial devices, and control devices.

Consisting of a GaAℓAs infrared light-emitting diode (LED) optically coupled to an integrated high-gain, high-speed photodetector IC chip, Toshiba's TLP152 achieves the industry's lowest output current of 2.5A with an SO6 package. In addition, this product contributes to low power consumption, with an operating power-supply voltage of 10V (min.).

With guaranteed minimum creepage and clearance distances of 5mm and an internal insulation thickness of 0.4mm, the TLP152 is compatible with the reinforced insulation category according to overseas safety standards for electronic instruments.

Features of the TLP152 include:

Output peak current: ± 2.5A (max)
Operating temperature: -40 degree C to 100 degree C
Supply current: 3 mA (max)
Supply voltage: 10 to 30V
Threshold input current: 7.5 mA(max)
Propagation delay time: tpHL = 190ns (max), tpLH = 170ns (max)
Common-mode transient immunity: ± 20 kV/µs (min)
Isolation voltage: 3750Vrms (min)
Operating power-supply voltage: V_cc = 10V to 30V

Pricing and Availability

Toshiba's TLP152 is available now. Budgetary pricing begins at $0.45 , with volume discounts available.

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, MP3 players, cameras, medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2011 Worldwide Semiconductor Revenue, March, 2012). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.

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