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Toshiba Introduces World's First 4K HDMI® To MIPI® CSI-2 Bridge Chipset For Mobile Application Processor Driven Innovation

Ultra HD (4K) HDMI to MIPI CSI-2 Enables Application Processor-Based 4K Reference Designs for Next-Generation CE Applications

SAN JOSE, Calif., March 17, 2014Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announces the addition of a new device to its MIPI Camera Serial Interface (CSI-2) converter chipset family. The Toshiba TC358840 Ultra HD HDMI® to MIPI® CSI-2 converter chipset supports 4K video resolution for next-generation CE video applications including 4K (3840 x 2160) resolution smart TVs, smart monitors, set-top boxes, and digital media adapters.

The Toshiba TC358840 is a follow on part to the Toshiba TC358743 and adds a 297 MHz HDMI receiver (Rx) and dual MIPI CSI-2 interface to support next-generation 4K Ultra HD video format. The maximum resolution supported is 4096 x 2160 @ 24bpp at a refresh rate of 24 fps or 3840 x 2160 @ 24bpp at a refresh rate of 30 fps, limited by a maximum 297 MHz HDMI bandwidth. HDMI audio input stream is also supported and can be transmitted over I2S, TDM, or the MIPI SLIMbus® (Serial Low-power Inter-chip Media Bus).

"Toshiba is the first company to offer a chipset that can convert an Ultra HD HDMI video stream to a dual CSI-2 video interface on an application processor for use in 4K capable s mart monitors, smart STBs, smart TVs and similar devices," says Deepak Prakash, senior director for the Logic LSI Business Unit, System LSI Group at TAEC. "The ability of the TC358840 to make the Ultra HD HDMI interface look like a camera interface extends the reach of the smartphone processor and opens up next-generation 4K opportunities for manufacturers to pursue."

The Toshiba TC358840XBG is an 80-pin device that comes in a small package size, 7.0 mm x 7.0 mm, with 0.65 mm ball pitch. The device is designed with clock and power management circuitry to support low-power states.

Pricing and Availability

Sample pricing for the TC358840XBG device is $ 5.00 (U.S.). Sample shipments are currently available with mass production scheduled for September 2014.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.toshiba.com/taec/support/techquestions/index.jsp or from your TAEC representative.

APIC 14 705