NEW TOSHIBA 4K CONVERTER CHIPSET DRIVES NEXT-GENERATION, DUAL DSI-READY LCD DISPLAYS FOR CONSUMER ELECTRONICS AND INDUSTRIAL APPLICATIONS
Industry-First 4K Chipset Converts HDMI® Signal to MIPI® dual-DSI Interface on Small Form-Factor Ultra HD LCD Displays
SAN JOSE, Calif., May 5, 2014 — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today adds the TC358870XBG Display Serial Interface (DSI) to its family of mobile peripheral IC products.
The TC358870XBG is a 4K High Definition Multimedia Interface (HDMI®) to MIPI® dual-DSI converter chipset with video format conversion. This is the first and only device in the market that enables direct 4K HDMI video input to LCD displays with MIPI dual-DSI interface, allowing small, form factor high-resolution mobile displays to be used in consumer and industrial applications.1
"The TC358870XBG provides design, performance and cost benefits making it suited for small, mobile consumer electronics and industrial products with high-resolution LCD displays requiring MIPI dual-DSI input," says Deepak Prakash, senior director for the Logic LSI Business Unit, System LSI Group at TAEC. "Application Processors with an HDMI interface used in traditional larger displays can now drive up to 3840 x 2160 display resolution in next-generation small form factor mobile devices including head-mounted displays (HMDs), digital camera displays, hand- held gaming accessories and wearable computing devices."
The TC358870XBG's 297 MHz HDMI input supports up to 3840 x 2160 @ 24bpp at a refresh rate of 30 fps and 2560 x 1600 @ 24bpp at a refresh rate of 60 fps. The device supports common 3D video formats and protocols compatible with the HDMI 1.4 standard. The TC358870XBG supports a MIPI dual DSI interface up to 8Gbps.
The Toshiba TC358870XBG is an 80-pin device for non-HDI boards with a small package size of 7.0 x 7.0 mm, 0.65 mm ball pitch and 1.2 mm maximum height.
Sample pricing for the TC358870XBG device is $5.00 (U.S.). Sample shipments are currently available with mass production scheduled for September, 2014.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, December 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 206,087 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
1Source: Toshiba America Electronic Components, Inc., research as of 4/11/2014. here.
HDMI is a registered trademark of HDMI Licensing, LLC in the United States and/or other countries.
MIPI is a registered trademark of MIPI Alliance, Inc.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.toshiba.com/taec/support/techquestions/index.jsp, or from your TAEC representative.
APIC 14 710