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Industry and Academia Partner to Explore Next Generation Power Electronics
Toshiba International Corporation, HOUSTON, TX—January 30, 2014 —Toshiba International Corporation (TIC) today announced a five-year commitment to the Next Generation Power Electronics Manufacturing Innovation Institute, a research and development consortium backed by the U.S. Department of Energy (DOE). TIC joins the institute as a partner in both financial support and active research in pursuit of wide bandgap (WBG) semiconductor-based power electronics.
"Toshiba International Corporation is very pleased to be part of the Next Generation Power Electronics Manufacturing Innovation Institute," said Mike Ayers, Group President of TIC Social Infrastructure. "This is an extraordinary opportunity to build a world class research, development and demonstration infrastructure, accelerate U.S. manufacturing in wide bandgap technology, and create sustained job growth."
The Next Generation Power Electronics Manufacturing Innovation Institute is supported in part by $70 million from the DOE and another $70 million through matched non-federal funds committed by the winning team of businesses and universities, along with the state of North Carolina. The more than 25 companies, universities, and government organizations comprising the institute will explore how WBG semiconductor technology can foster the development of more affordable and efficient power electronics. Applications include renewable power interconnection, industrial-scale variable speed drive, electric vehicles, personal devices, and a more flexible grid.
Based at North Carolina State University, the Next Generation Power Electronics Manufacturing Innovation Institute is the first of up to 45 expected manufacturing innovation institutes. This future network of regional hubs will bridge the existing gaps between collaborators and applied research and product development. For more information, visit www.ncsu.edu/power.
WBG semiconductors are widely believed to be the next step in semiconductor technology. By using silicon carbide and gallium nitride, WBG semiconductors are more durable and reliable. This technology will lower the cost of power electronics resulting in new jobs and economic growth.
Next Generation Power Electronics Manufacturing Innovation Institute by the numbers:
Toshiba International Corporation (TIC) is a Toshiba America Inc. (TAI) Group Company, a wholly owned subsidiary of Toshiba Corporation, and comprised of four divisions - Motors & Drives, Automotive, Power Electronics and Transmission & Distribution. Headquartered in Houston, Texas, TIC provides application solutions to a wide range of industries including general industrial, oil and gas, utilities, datacenters, renewables, HVAC, water/wastewater, and mining. For more information about TIC, please visit www.toshiba.com/tic.
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